Wafer cutting machine

Wafer cutting machine

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Wafer cutting machine

  • Detail
  • Parameters

AD3000T

The maximum working size phi 310

12 inch maximum compatibility structure (430 Φ)

The spindle

Rotation times 60,000 RPM OP:80,000 RPM

The maximum blade diameter is 60

The blade spacing is 21mm

The X axis

Cutting stroke is 310mm

The maximum speed is 1000mm/s

Drive mode ball screw + LM guide rail ac servo

Select linear motor + air guide

Y1, Y2 shaft

Cutting stroke is 310mm

The maximum speed is 300mm/s

Positioning resolution 0.0002mm

Drive mode ball screw + LM guide rail

Z1, Z2 axis

Stroke 34 mm

Repeatability 0.001mm

Drive mode ball screw + LM guide rail

Theta axis).

380 ° rotation range

Positioning resolution 0.00014 °

Direct drive


Introduce
AD3000T  The maximum working size phi 310  12 inch maximum compatibility structure (430 Φ)  The spindle  Rotation times 60,000 RPM OP:80,000 RPM  The maximum blade diameter is 60  The blade spacing is